TIN-ZINC BASED LEAD-FREE SOLDER ALLOY AND ITS MIXTURE
Japan Patent
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Abstract
PROBLEM TO BE SOLVED: To provide tin-zinc based lead-free soldering alloy which enables wettability to be improved in cream solder and which also excels in preservability for a long period.
SOLUTION: The tin-zinc based lead-free solder alloy contains tin as the main composition and at least 6-10 wt% zinc indispensably. In addition, while a magnesium oxide protective film is formed on the surface of the solder, it is composed by blending 0.0015-0.1 wt% magnesium which is an effective ratio for the oxide protective film to be broken at the time of melting of the solder. Also, in preserving the cream solder, the magnesium oxide protective film formed on the surface of the solder powder protects the inside, suppressing a reaction between zinc and an activator and enhancing the preservability. Further, at the time of rising temperature for melting the solder, the oxide protective film has a tendency to be easily broken, thereby providing improved wettability.
COPYRIGHT: (C)2004,JPO
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