SINGLE PARTICLE FILM ETCHING MASK AND MICROSTRUCTURE OBTAINED BY USING THE SAME

Japan Patent

APP PUB NO JP-2013137578-A
SERIAL NO

2013080856

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Abstract

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PROBLEM TO BE SOLVED: To obtain a microstructure suitable for a precursor of an anti-reflector, a nanoimprint, or a mold for injection molding by a single particle film etching mask in which respective particles constituting a single particle film are close packed two-dimensionally and are arrayed with high accuracy.SOLUTION: A single particle film etching mask has particles close packed two-dimensionally, and displacement D(%) of particle arrays which is defined by D(%)=|B-A|×100/A is 10% or less, where A represents an average particle size of particles and B represents an average pitch between particles in the single particle film.

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Patent Owner(s)

Patent OwnerAddress
OJI HOLDINGS CORPNot Provided

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Inventor(s)

Inventor Name Address
SHINOZUKA HIROSHI -

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