THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICS

Korea, Republic of Patent

APP PUB NO KR-20080044304-A
SERIAL NO

20087006669

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Abstract

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A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a non-metallic, thermally conductive material such that the composition has a coefficient of thermal expansion of less than 20 ppm/C and a thermal conductivity of greater than 1.0 W/mK. Using injection molding techniques, the composition can be molten and then injected into a die containing the microelectronics to encapsulate the microelectronics therein.

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Patent Owner(s)

Patent OwnerAddress
COOL OPTIONS INCUSWARWICK RI 02886

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Inventor(s)

Inventor Name Address
MILLER JAMES D PEPPERELL MA 01463

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