Production of shielded printed circuit board involves applying fixing agent and positioning shield comprising preformed metallized plastic film over electronic component(s)

Netherlands

PATENT NO 1016354
SERIAL NO

1016354

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Abstract

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A shielded printed circuit board is produced by applying a flowable electrically conducting fixing agent to contact points on the circuit board, positioning electronic component on the contact points, and positioning a shield comprising preformed metallized plastic film over top electronic component(s). Production of shielded printed circuit board comprises applying a flowable electrically conducting fixing agent to contact points (15) on the circuit board. The electronic components (14) are positioned on the contact points of the board (11). A shield (20) comprising a preformed metallized plastic film is positioned over the top of the electronic component(s). The electronic component(s) is fixed simultaneously on the contact points and the shield by increasing the temperature above the flowing point of the fixing agent.

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