Method for constructing a thermoelectric module and the module so obtained
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United States of America
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Jun 16, 1981
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N/A
app pub date -
Dec 13, 1978
filing date -
Sep 30, 1975
priority date (Note) -
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Abstract
This invention relates to a method for constructing a thermoelectric module, as well as to the module so obtained. The method according to the invention comprises the steps of construction a reference shoulder on the semiconductor bar, assembling the semiconductor bars in series by using an insulating cement, cleaning the surfaces, gold plating, nickel plating, brasing copper electrodes, machining the regions between the elements which have to remain insulated, protecting the copper electrodes by nickel or chromium plating. The thermoelectric module so obtained consists of a matrix of semiconductor elements with all the mechanical and electrical connections incorporated, including the input and output terminals.
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