Device for interconnecting integrated circuit packages to circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America
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-
Feb 17, 1998
Grant Date -
N/A
app pub date -
Dec 9, 1994
filing date -
Nov 26, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.
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