Electronic component support for memory card and product obtained thereby
Number of patents in Portfolio can not be more than 2000
United States of America
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Oct 26, 1999
Grant Date -
N/A
app pub date -
Jun 1, 1994
filing date -
Dec 14, 1987
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The disclosure relates to memory cards having an electronic component housed in a cavity. The electronic support has a first base made of silicon, with a small thickness (between 50 and 100 microns) and a thicker (between 200 and 300 microns) second base, which is deposited on the first base and is formed by a material which is harder than silicon, such as cobalt, vanadium, titanium or ceramic.
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