Multi-chip stacked devices
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 14, 2000
Grant Date -
N/A
app pub date -
Feb 29, 1996
filing date -
Apr 6, 1993
priority date (Note) -
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Abstract
A multiple stacked die device is disclosed that contains up to four dies and does not exceed the height of current single die packages. Close-tolerance stacking is made possible by a low-loop-profile wire-bonding operation and thin-adhesive layer between the stacked dies.
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