Guard ring electrostatic chuck
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United States of America Patent
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-
Mar 12, 2002
Grant Date -
N/A
app pub date -
Mar 18, 1999
filing date -
Dec 20, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electrostatic chuck is disclosed that is resistant to the formation of vacuum arcs between the back of the wafer being processed and the body of the chuck. A guard ring surrounds the chuck and floats close to the self-bias potential induced by the plasma on the wafer. The voltage between the wafer and the closest electrode is thereby capacitively divided by the guard ring.
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