Method for controlling configuration of laser induced breakdown and ablation

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United States of America Patent

PATENT NO RE37585
SERIAL NO

09366685

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (F.sub.th) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired. The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.

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Patent Owner(s)

  • AMO DEVELOPMENT, LLC;THE REGENTS OF THE UNIVERSITY OF MICHIGAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Du, Detao Fremont, CA 16 641
Dutta, Subrata K Ann Arbor, MI 3 649
Elner, Victor Ann Arbor, MI 2 634
Kurtz, Ron Ann Arbor, MI 13 879
Lichter, Paul R Ann Arbor, MI 3 637
Liu, Xinbing Acton, MA 81 2482
Mourou, Gerard Ann Arbor, MI 26 732
Pronko, Peter P Dexter, MI 8 722
Squier, Jeffrey A San Diego, CA 2 634

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