Process for preparing a nonconductive substrate for electroplating
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United States of America Patent
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Jun 25, 2002
Grant Date -
N/A
app pub date -
Feb 22, 1999
filing date -
May 1, 1991
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Abstract
Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising pretreating the material with a carbon black dispersion followed by a graphite dispersion before the electroplating step.
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