Method of preparing a printed circuit board
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United States of America Patent
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-
Sep 17, 2002
Grant Date -
N/A
app pub date -
Sep 23, 1998
filing date -
Nov 21, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surfaces of the printed circuit board. These plated through holes contain a bill composition.
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