Semiconductor device
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United States of America Patent
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Oct 19, 2010
Grant Date -
N/A
app pub date -
Jun 11, 2007
filing date -
Jan 29, 2003
priority date (Note) -
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Abstract
In a semiconductor device in which a semiconductor chip is stacked on a substrate, an interposer chip having wirings is provided under the semiconductor chip. A bonding pad of the semiconductor chip is electrically connected to a bonding terminal provided on the substrate via the interposer chip by wire bonding. The interposer chip prevents a semiconductor element formed in the semiconductor chip from deteriorating in terms of an electric property and from being physically damaged. Further, the wire bonding strength does not drop. Moreover, it is possible to form a fine wiring pitch for relaying a wire-bonding wire.
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