Thin multi-chip flex module
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United States of America Patent
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Mar 29, 2011
Grant Date -
N/A
app pub date -
Jul 20, 2010
filing date -
Jan 2, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.
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