Thermal flow rate measuring device

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United States of America Patent

PATENT NO RE42529
SERIAL NO

11143971

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Abstract

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A thermal type flow rate measuring device can certainly prevent adhesion of water droplet onto a sensor element and thus achieve high reliability. The thermal type flow rate measuring device includes an auxiliary passage defined within a main passage for introducing a part of fluid flowing through the main passage, a sensor disposed within the auxiliary passage for detecting flow rate of the fluid and capturing means formed on an inner periphery of the auxiliary passage for capturing liquid contained in the fluid and transferring the captured liquid.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Horie, Junichi Hitachinaka, JP 38 519
Nakada, Keiichi Munich, DE 49 523
Ueyama, Kei Nagoya, JP 20 202
Watanabe, Izumi Hitachinaka, JP 84 1312

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