Photo-curable resin composition used for photo-fabrication of three-dimensional object

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United States of America Patent

PATENT NO RE42593
SERIAL NO

10671438

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Abstract

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A photocurable resin composition suitable for photo-fabrication. The resin composition capable of being promptly cured by photo-irradiation, thereby reducing fabricating time and providing cured products having excellent mechanical strength and minimized shrinkage during curing to ensure high dimensional accuracy. The composition includes (A) an oxetane compound, (B) an epoxy compound, and (C) a cationic photo-initiator.

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Patent Owner(s)

Patent OwnerAddress
DSM IP ASSETS B VMAASTRIK NETHERLANDS MAASTRICHT LIMBURG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takeuchi, Akira Tokyo, JP 85 713
Ukachi, Takashi Ibaraki, JP 71 1047
Watanabe, Tsuyoshi Tokyo, JP 251 3095
Yamamura, Tetsuya Tokyo, JP 21 300

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