Methods for providing void-free layer for semiconductor assemblies
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United States of America Patent
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May 22, 2012
Grant Date -
N/A
app pub date -
Mar 22, 2010
filing date -
Mar 7, 1996
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Abstract
A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic component to form a void free layer.
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