Semiconductor device manufacturing method having high aspect ratio insulating film

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United States of America Patent

PATENT NO RE45361
SERIAL NO

14068785

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Abstract

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The object of the present invention is to embed an insulating film in a hole having a high aspect ratio and a small width without the occurrence of a void. The thickness of a polishing stopper layer is reduced by making separate layers respectively serve as a mask during forming the hole in a semiconductor substrate, and a stopper during removing the insulating film filled in the hole.

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Patent Owner(s)

  • PS4 LUXCO S.A.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirota, Toshiyuki Tokyo, JP 113 1846

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