Integrated circuit having oversized components and method of manufacture thereof

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United States of America Patent

PATENT NO RE45507
SERIAL NO

14085128

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An integrated circuit includes electrical components that include one or more electrical elements on one or more dielectric layers. The electrical element has a geometric shape that exceeds prescribed integrated circuit manufacturing limits in at least one dimension. To achieve compliance with foundry rules, the electrical element is fabricated to include a non-conducting region that negligibly effects the electrical characteristics. The non-conducting region includes a hole, a series of holes, a slot and/or a series of slots spaced within the electrical element at dimensions that are less than the integrated circuit manufacturing limits.

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Patent Owner(s)

  • BROADCOM CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Contopanagos, Harry Santa Monica, US 27 245
Komninakis, Christos Los Angeles, US 19 399

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