Integrated circuit having oversized components and method of manufacture thereof
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United States of America Patent
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May 5, 2015
Grant Date -
N/A
app pub date -
Nov 20, 2013
filing date -
Nov 20, 2013
priority date (Note) -
Withdrawn
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Abstract
An integrated circuit includes electrical components that include one or more electrical elements on one or more dielectric layers. The electrical element has a geometric shape that exceeds prescribed integrated circuit manufacturing limits in at least one dimension. To achieve compliance with foundry rules, the electrical element is fabricated to include a non-conducting region that negligibly effects the electrical characteristics. The non-conducting region includes a hole, a series of holes, a slot and/or a series of slots spaced within the electrical element at dimensions that are less than the integrated circuit manufacturing limits.
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