Polishing pad, polishing method and method of forming polishing pad

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United States of America Patent

PATENT NO RE46648
SERIAL NO

14793416

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Abstract

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A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.

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Patent Owner(s)

Patent OwnerAddress
IV TECHNOLOGIES CO LTDNO 12 ROAD 9 TAICHUNG INDUSTRIAL PARK TAICHUNG CITY 407

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Yu-Piao Jubei, TW 26 116

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