Three-dimensional nonvolatile memory cell structure with upper body connection

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United States of America

PATENT NO RE47816
SERIAL NO

15869245

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Abstract

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A three-dimensional integrated circuit non-volatile memory array includes a memory array of vertical channel NAND flash strings connected between a substrate source line and upper layer connection lines which each include n-type drain regions and p-type body line contact regions alternately disposed on each side of undoped or lightly doped string body regions so that each NAND flash string includes a vertical string body portion connected to a horizontal string body portion formed from the string body regions of the upper body connection lines.

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Patent Owner(s)

  • CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rhie, Hyoung Seub Ottawa, CA 32 202

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