Method and arrangement for handling and processing substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO RE49725
SERIAL NO

17025997

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The invention relates to a substrate handling and exposure arrangement comprising a plurality of lithography apparatus, a clamp preparation unit for clamping a wafer on a wafer support structure, a wafer track, wherein the clamp preparation unit is configured for accepting a wafer from the wafer track, and an additional wafer track for transferring the clamp towards the plurality of lithography apparatus.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ASML NETHERLANDS B V5500 AH VELDHOVEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
De, Jong Hendrik Jan The Hague, NL 16 321
Wieland, Marco Jan-Jaco Delft, NL 104 1084

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 May 14, 2027
7.5 Year Payment $3600.00 $1800.00 $900.00 May 14, 2031
11.5 Year Payment $7400.00 $3700.00 $1850.00 May 14, 2035
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00