Semiconductor device and method of manufacturing the same, and electronic apparatus
Number of patents in Portfolio can not be more than 2000
United States of America
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Sep 17, 2024
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N/A
app pub date -
Nov 24, 2021
filing date -
Nov 24, 2021
priority date (Note) -
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Abstract
The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device that enable prevention of generation of tape scraps from the dicing tape during dicing, and an electronic apparatus. When a semiconductor substrate on which a protective film for protecting a circuit surface is formed is divided, dicing is performed so as to form a portion in which the section width of the semiconductor substrate differs from the section width of the protective film. The present technology can be applied to a wafer level CSP manufacturing process and the like, for example.
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