Thermoelectric structure

Taiwan, Republic of China Patent

APP PUB NO TW-201733173-A
SERIAL NO

105107690

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Abstract

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The present disclosure provides a thermoelectric structure including a thermoelectric substrate and a barrier layer covering the thermoelectric substrate. A material of the barrier layer is a metallic glass. The thermoelectric structure of the present disclosure may apply to a medium temperature (about 400K to about 800K) thermoelectric module to effectively block the diffusion of the thermoelectric substrate.

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Patent Owner(s)

Patent OwnerAddress
UNIV NAT TAIWAN SCIENCE & TECHNOLOGYTW

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Inventor(s)

Inventor Name Address
CHU JINN TAIPEI
YU CHIA-CHI NEW TAIPEI CITY
WU HSIN-JAY KAOHSIUNG

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