Pellicle for EUV mask and fabrication thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10031411
SERIAL NO

14799616

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Abstract

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The present disclosure provides a method in accordance with some embodiments. A wafer is grinded from a back side. The wafer is inserted into an opening defined by a frame holder. The frame holder is attached to a carrier through a temporary layer. A front side of the wafer is attached to the temporary layer. Thereafter, the wafer is etched from the back side until the wafer reaches a predetermined thickness. Thereafter, the frame holder and the wafer therein are separated from the temporary layer and the carrier.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jeng-Horng Hsin-Chu, TW 137 3250
Shih, Chih-Tsung Hsinchu, TW 146 2276
Yen, Anthony Hsinchu, TW 157 3414
Yu, Shinn-Sheng Hsinchu, TW 132 3917

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