Distributed transceiver signal switching circuit
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 28, 2020
Grant Date -
Dec 5, 2019
app pub date -
Aug 1, 2019
filing date -
Aug 1, 2019
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An apparatus includes a package and a chip. The package may comprise (i) a plurality of bonding pads, (ii) a plurality of combiner/splitter circuits, and (iii) a plurality of bumps. The bonding pads may be configured to electrically connect the package with a printed circuit board substrate. The combiner/splitter circuits generally connect each of the bonding pads to two respective bumps of the plurality of bumps. The chip is generally disposed in the package. The chip may comprise a plurality of contact pads and a plurality of transceiver channels. Each of the transceiver channels may comprise a radio-frequency input and a radio-frequency output. The radio-frequency input and the radio-frequency output of each transceiver channel are generally connected to respective contact pads of the chip. The respective contact pads of each transceiver channel are generally coupled to a respective bonding pad of the package via the two respective bumps.
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