Electrolytic copper foil

United States of America

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Abstract

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Provided is an electrodeposited copper foil having high smoothness and at the same time exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has a ten-point average roughness Rz of 0.1 μm or larger and 2.0 μm or smaller on at least one surface, has a tensile strength measured in accordance with IPC-TM-650 of 56 kgf/mm2 or more and less than 65 kgf/mm2 in an unannealed original state, and has a tensile strength measured in accordance with IPC-TM-650 of 15 kgf/mm2 or more and less than 25 kgf/mm2 after annealing at 180° C. for 1 hour.

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Patent Owner(s)

Patent OwnerAddress
MITSUI MINING & SMELTING CO LTDJP11-1 OSAKI 1-CHOME SHINAGAWA-KU TOKYO 1418584 ?1418584

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Inventor(s)

Inventor Name Address
WADA MITSUHIRO 〒1008280 東京都千代田区丸の内一丁目６番６号 株式会社日立製作所内 ?1008280
NAKAJIMA DAISUKE 〒5291156 滋賀県彦根市清崎町６０番地 株式会社レゾナック・パッケージング内 SHIGA ?5291156
HARA YASUJI 〒3620017 埼玉県上尾市二つ宮６５６－２ 三井金属鉱業株式会社内 SAITAMA ?3620017
MATSUDA MITSUYOSHI TOKYO JAPAN TOKYO METROPOLIS

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