WIREBOND STRUCTURES
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United States of America Patent
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N/A
Issued Date -
Dec 2, 2010
app pub date -
May 24, 2010
filing date -
May 26, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments of the present disclosure provide an apparatus comprising a semiconductor die, a bond pad formed on the semiconductor die, the bond pad comprising aluminum (Al), a bonding material comprising gold (Au) coupled to the bond pad, the bonding material covering at least a portion of the bond pad, and a wire coupled to the bonding material, the wire comprising copper (Cu). Other embodiments may be described and/or claimed.
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