WIREBOND STRUCTURES

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United States of America Patent

APP PUB NO 20100301467A1
SERIAL NO

12786260

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Abstract

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Embodiments of the present disclosure provide an apparatus comprising a semiconductor die, a bond pad formed on the semiconductor die, the bond pad comprising aluminum (Al), a bonding material comprising gold (Au) coupled to the bond pad, the bonding material covering at least a portion of the bond pad, and a wire coupled to the bonding material, the wire comprising copper (Cu). Other embodiments may be described and/or claimed.

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Patent Owner(s)

Patent OwnerAddress
MARVELL WORLD TRADE LTDST MICHAEL 14027

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, Albert Palo Alto, US 108 736

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