WIREBOND STRUCTURES

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100301467A1
SERIAL NO

12786260

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Embodiments of the present disclosure provide an apparatus comprising a semiconductor die, a bond pad formed on the semiconductor die, the bond pad comprising aluminum (Al), a bonding material comprising gold (Au) coupled to the bond pad, the bonding material covering at least a portion of the bond pad, and a wire coupled to the bonding material, the wire comprising copper (Cu). Other embodiments may be described and/or claimed.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
MARVELL WORLD TRADE LTDL'HORIZON GUNSITE ROAD BRITTONS HILL ST MICHAEL BB14027

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, Albert Palo Alto, US 116 1040

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation