Method for Manufacturing Microelectronic Devices and Devices According to Such Methods
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United States of America Patent
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Issued Date -
Jul 7, 2011
app pub date -
Nov 29, 2010
filing date -
Nov 30, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method is disclosed for manufacturing a sealed cavity in a microelectronic device, comprising forming a sacrificial layer at least at locations where the cavity is to be provided, depositing a membrane layer over the top of the sacrificial layer, patterning the membrane layer in at least two separate membrane layer blocks, removing the sacrificial layer through the membrane layer, and sealing the cavity by sealing the membrane layer, wherein patterning the membrane layer is performed after removal of the sacrificial layer.
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