Layer Cutting Apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jul 26, 2012
app pub date -
Apr 5, 2012
filing date -
Feb 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A layer cutting apparatus includes a tray having an interior defined by a bottom and sidewall. A sleeve is at least partially disposed in the interior of the tray, and a cutting line is attached to the sleeve. The cutting line is configured to be removed from the sleeve by pulling the line away from the tray at one point of the sidewall.
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