DIE-TO-DIE ELECTRICAL ISOLATION IN A SEMICONDUCTOR PACKAGE

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United States of America Patent

APP PUB NO 20140055217A1
SERIAL NO

14057231

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Some of the embodiments of the present disclosure provide a semiconductor package comprising a first die; a second die; and an inductor arrangement configured to inductively couple the first die and the second die while maintaining electrical isolation between active circuit components of the first die and active circuit components of the second die. Other embodiments are also described and claimed.

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Patent Owner(s)

Patent OwnerAddress
MARVELL WORLD TRADE LTDST MICHAEL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sutardja, Sehat Los Altos Hills, US 537 5589

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