CURABLE ADHESIVE COMPOSITIONS AND USE THEREOF

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United States of America Patent

SERIAL NO

15292626

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Abstract

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A solvent-less hybrid curable composition is prepared from grafting polyesters or polyamides onto a (meth)acrylic copolymer backbone. Besides the many benefits of a solvent-less system, the hybrid curable composition forms strong adhesion to polar substrates, widens the use temperatures, and enables faster processing speeds than conventional hybrid curable compositions. The solvent-less hybrid curable composition forms an optically clear single phase that is suitable as tapes and labels, or in electronic, optoelectronic, OLED and photovoltaic devices, and the like.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LI, Chunzhao Vernon Hills, US 7 15
LU, Victor X Marietta, US 1 0

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