Method for producing an electronic component, and electronic assembly, a heating device being provided in the substrate of the assembly
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United States of America Patent
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Feb 6, 2018
Issued Date -
N/A
app pub date -
Jun 17, 2015
filing date -
Jul 11, 2014
priority date (Note) -
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Abstract
A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.
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