THERMOPLASTIC STRIKE LAYER FOR BONDING MATERIALS

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United States of America Patent

SERIAL NO

15827949

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Abstract

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Apparatuses and methods are disclosed that may be used to bond materials using thermoset and thermoplastic polymer materials arranged with a thermoplastic strike layer on a surface of the material. Apparatuses and methods are also disclosed for manufacturing and configuring catheters and other tubular devices with a bonding surface or layer. These apparatuses and devices may have a strike layer of thermoplastic polymer material that melts or softens upon application of heat and bonds to other polymer materials upon cooling, thus avoiding the use of externally-applied adhesives in the construction of a bond between two surfaces, such as between an inner surface of a tubular catheter and an outer surface of a tubular catheter tip.

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Patent Owner(s)

Patent OwnerAddress
ST JUDE MEDICAL PUERTO RICO LLCCAGUAS PR

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arnold, John F Andover, US 2 160
Ford, Brent Minneapolis, US 7 70
Marass, Timothy S Minneapolis, US 12 9
Strom, Nicholas Minneapolis, US 8 9

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