Semiconductor module, electronic component and method of manufacturing a semiconductor module

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United States of America Patent

PATENT NO 11069639
APP PUB NO 20190267343A1
SERIAL NO

16282401

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In an embodiment, a module includes a first electronic device in a first device region and a second electronic device in a second device region. The first electronic device is operably coupled to the second electronic device to form a circuit. Side faces of the first electronic device and of the second electronic device are embedded in, and in direct contact with, a first epoxy layer.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AUSTRIA AG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clavette, Danny Greene, US 45 74
Feil, Thomas Villach, AT 39 153
von, Koblinski Carsten Villach, AT 55 379

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