LAMINATING FILM ADHESIVES WITH ULTRA-LOW MOISTURE PERMEABILITY

United States of America

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Abstract

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The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for electronic devices that require low water vapor transmission rate.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHDEHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address
JIANG HONG WESTFIELD NJ

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