Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
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United States of America Patent
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Aug 28, 2001
Issued Date -
N/A
app pub date -
Apr 27, 2000
filing date -
Feb 2, 1999
priority date (Note) -
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Abstract
A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing package pins with dedicated electrical paths through the package to the bottom surface of the heat sink. Such an arrangement provides very low RF impedance because of the minimal length and resistance of the shorting path, and also provides minimal disruption of the PCB design rules and tolerances by using existing package leads.
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