Package construction of semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6317333
SERIAL NO

09427583

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device includes a ball grid array substrate including an upper insulating layer of laminated insulating layers, an intermediate insulating layer, and a lower insulating layer of laminated insulating layers; lines on each top surface of the insulating layers included in the upper insulating layer, the intermediate insulating layer, and the lower insulating layer, respectively; and a semiconductor chip having electrodes connected to the lines, the semiconductor chip being connected with solder balls through via holes in each of the insulating layers, the solder balls being located on an outermost surface of the lower insulating layer.

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Patent Owner(s)

Patent OwnerAddress
TESSERA ADVANCED TECHNOLOGIES INC3025 ORCHARD PARKWAY SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baba, Shinji Tokyo, JP 75 933

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