Method of assembling a circuit board into a housing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6647618
APP PUB NO 20010053067A1
SERIAL NO

09935605

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of assembling a circuit board into a housing to form an assembly is disclosed. The method includes inserting a first end of the circuit board into a first slot of the housing, flexing the circuit board over a deflection/retention feature, inserting a second end of the circuit board into a second slot of the housing, and pressing the circuit board into place until the circuit board clears the deflection/retention feature and snaps into place. The circuit board thereafter returns to a substantially flat state. Moreover, inserting a first end of the circuit board into a first slot of the housing and inserting a second end of the circuit board into a second slot of the housing each include simplifying initial alignment of the circuit board into the slot by first contacting a lower surface of the slot that extends farther from a front of the housing than an upper surface of the slot.

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First Claim

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Patent Owner(s)

  • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wortman, Michael Roseville, CA 13 126

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