Semiconductor apparatus and method of manufacturing same

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United States of America Patent

PATENT NO 7064005
APP PUB NO 20040115919A1
SERIAL NO

10474863

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Abstract

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A semiconductor apparatus that allow miniaturization of a multichip module using an interposer substrate and a method of manufacturing the same are provided. It is configured that an embedded electrode (4) penetrating through an interposer substrate (1) is provided, one end thereof is made to be connected to a connection electrode (2) on which device chips (10) are flip-chip mounted, and connecting to an unillustrated mounting substrate via a bump electrode (5), that is, because an electrode connecting the mounting substrate is made to be drawn out from the back surface of the interposer substrate (1), a multichip module can be miniaturized.

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Patent Owner(s)

Patent OwnerAddress
TESSERA ADVANCED TECHNOLOGIES INC3025 ORCHARD PARKWAY SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takaoka, Yuji Kanagawa, JP 25 233

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