Apparatus and system for cooling heat producing components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7403393
APP PUB NO 20070146996A1
SERIAL NO

11319315

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing circuit board component, and a heat sink having first and second ends. The heat sink is configured to interface with the mounting plate in order to provide a downward force on the heat producing circuit board component. The apparatus also includes at least one bellows device coupling a heat transfer tip with the first end of the heat sink, wherein the bellows device is configured to transfer the downward force from the mounting plate to a top surface of the heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the heat producing component. The system includes a circuit board, a plurality of heat producing circuit board components, and the described apparatus.

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Patent Owner(s)

Patent OwnerAddress
LENOVO INTERNATIONAL LIMITED979 KING'S ROAD 23/F LINCOLN HOUSE TAIKOO PLACE QUARRY BAY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Herring, Dean Frederick Youngsville, NC 86 687
Kamath, Vinod Raleigh, NC 70 1585
Wormsbecher, Paul Andrew Apex, NC 32 305

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