3D smart power module
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United States of America Patent
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Oct 5, 2010
Grant Date -
Aug 13, 2009
app pub date -
Feb 8, 2008
filing date -
Feb 8, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.
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