Methods for bonding and micro-electronic devices produced according to such methods
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United States of America Patent
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Feb 1, 2011
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N/A
app pub date -
May 11, 2009
filing date -
Jun 8, 2005
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Abstract
One inventive aspect is related to a method of bonding two elements and micro-electronic devices produced according to such methods. In one aspect, a micro-electronic device includes a first and a second element, bonded together by a joining structure. The joining structure has a first micropattern portion, a second micropattern portion, and a joining portion in between the first and second micropattern portions. The first and second micropattern portions are made of cobalt. The joining portion includes intermetallic compounds of cobalt and tin (Sn).
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