Method for forming 3D-interconnect structures with airgaps

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United States of America Patent

PATENT NO 8647920
APP PUB NO 20120013022A1
SERIAL NO

13183315

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Abstract

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Ultra-low capacitance interconnect structures, preferably Through Silicon Via (TSV) interconnects and methods for fabricating said interconnects are disclosed. The fabrication method comprises the steps of providing a substrate having a first main surface, producing at least one hollow trench-like structure therein from the first main surface, said trench-like structure surrounding an inner pillar structure of substrate material, depositing a dielectric liner which pinches off said hollow trench-like structure at the first main surface such that an airgap is created in the center of hollow trench-like structure and further creating a TSV hole and filling it at least partly with conductive material.

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Patent Owner(s)

Patent OwnerAddress
IMECKAPELDREEF 75 LEUVEN 3001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beyne, Eric Leuven, BE 68 1947
Civale, Yann Leuven, BE 3 54
Tezcan, Deniz Sabuncuoglu Neerwinden, BE 4 34

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