Attaching passive components to a semiconductor package
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United States of America Patent
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Mar 24, 2015
Grant Date -
Jul 14, 2011
app pub date -
Nov 10, 2010
filing date -
Jan 12, 2010
priority date (Note) -
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Abstract
Embodiments of the present disclosure provide a method comprising forming an electrically conductive structure on a surface of a semiconductor die, attaching the semiconductor die to a substrate, forming a molding compound to encapsulate the semiconductor die, forming an opening in the molding compound, the opening to at least partially expose the electrically conductive structure, and electrically coupling a passive component to the electrically conductive structure through the opening in the molding compound. Other embodiments may be described and/or claimed.
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