Copper cleaning and protection formulations

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9074170
SERIAL NO

13124942

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Importance

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Abstract

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A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

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Patent Owner(s)

Patent OwnerAddress
MORGAN STANLEY SENIOR FUNDING INC1300 THAMES STREET 4TH FLOOR BALTIMORE MD 21231

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barnes, Jeffrey A Bethlehem, US 26 586
Benac, Brian Marble Falls, US 5 129
Boggs, Karl E Hopewell Junction, US 21 425
Feng, Lin Orange, US 52 222
Liu, Jun Brookfield, US 1497 18125
Petruska, Melissa A Newtown, US 29 418
Yan, Xiaodong New Milford, US 5 61
Zhang, Peng Montvale, US 846 8792

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