Integrated inductor and integrated inductor fabricating method

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United States of America Patent

PATENT NO 9214511
APP PUB NO 20140284763A1
SERIAL NO

14203506

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Abstract

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The present invention provides an integrated inductor and an integrated inductor fabricating method. The integrated inductor comprises: a semiconductor substrate, an inductor, and a redistribution layer (RDL). The inductor is formed above the semiconductor substrate. The RDL is formed above the inductor and has a specific pattern to form a patterned ground shield (PGS). The integrated inductor fabricating method comprises: forming a semiconductor substrate; forming an inductor above the semiconductor substrate; and forming redistribution layer (RDL) having a specific pattern above the inductor to form a patterned ground shield (PGS).

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Patent Owner(s)

Patent OwnerAddress
REALTEK SEMICONDUCTOR CORP2 INNOVATION RD II SCIENCE PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yeh, Ta-Hsun Hsinchu, TW 84 404

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