Detecting thermal interface material (‘TIM’) between a heat sink and an integrated circuit
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United States of America Patent
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Sep 6, 2016
Grant Date -
Dec 31, 2015
app pub date -
Sep 10, 2015
filing date -
May 11, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Detecting TIM between a heat sink and an integrated circuit, the heat sink including TIM detection points, each TIM detection point adapted to receive TIM upon installation of the heat sink, each TIM detection point including a TIM detection device configured to be activated upon contact with TIM, including: receiving, upon installation of the heat sink on the integrated circuit and the TIM, TIM in one or more of the TIM detection points; activating, by the TIM in each of the one or more TIM detection points receiving the TIM, a TIM detection device; and determining, by a TIM detection module in dependence upon the activations of the TIM detection devices, sufficiency of the TIM between the heat sink and the integrated circuit.
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