Curable encapsulants and use thereof

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United States of America Patent

PATENT NO 9676928
SERIAL NO

14529438

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Abstract

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The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Konarski, Mark Old Saybrook, US 2 2
Liu, Yuxia Dayton, US 16 38
Palasz, Peter D Berks, GB 17 84
Paul, Charles W Morristown, US 72 937

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